Chroma 7980 2D/3D wafer metrology system provides accurate and reliable profile information. 7980 adopts newly developed BLiS technology and specially designed platform to achieve 2D/3D nanoscale measurement. Purpose-built software is provided for different applications, especially in the advanced packaging. The large-area stitching capability can meet various needs in the industry. The UI includes 2D/3D graphic display for the recipe setting and measurement results.
2D/3D Wafer Metrology System Model 7980
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Key Features
- Patented BLiS technology for nondestructive surface profile measurement and analysis
- Large Area Pictures Stitch function
- High WPH
- Quality Control Monitor
- SEMI S2 certified
- Applies to 6" ~12" Wafer
- Semi-Auto or Fully-Auto available
Applications:
- Advanced Packaging: TSV, VIA, RDL
- 2D/3D CD measurement: Overlay, Film Thickness, Bump Height, Step Height
- Nano Scale 3D surface topography, Roughness
